Call for Papers Design Methodologies, Verification Within-die circuits for process characterisation/monitoring Design enablement – Characterisation and validation of digital and analog libraries Devices and Circuit Modelling Measurement techniques DC, AC and RF measurements: setup, test and analysis Reliability test - including thermal stability, failure analysis etc. Statistical analysis, variability, throughput increase, smart test strategies Use of machine learning and AI in analysis of data sets - parameter extraction etc. Wafer probing, within-die measurements, in-line metrology Throughput, testing strategies, yield enhancement and process control tests Applications Emerging memory technologies (single cell, arrays, and application in neural networks) Emerging transistor technologies for digital/analog/power applications Photonic devices - silicon integration, new displays (OLED, μ-displays) Flexible electronics and sensors (organic and inorganic materials) M(N)EMS, actuators, sensors, PV cells and other emerging devices