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For doctoral students, data scientists, and artificial intelligence researchers, finding the right venue to publish your latest algorithms or neural network models is critical. If you are asking yourself, "Where should I publish my AI papers in 2026?", targeting international conferences hosted in China is one of the most strategic moves you can make.

China has rapidly become the world's leading hub for artificial intelligence, computer vision, and machine learning research. Presenting your work at these premier academic symposia ensures rigorous double-blind peer review and secures your indexation in world-class databases, including EI Compendex and Scopus.
Below is your ultimate guide to 11 elite AI, machine learning, and intelligent computing conferences accepting submissions for 2026 and early 2027 across China's major tech hubs.
If your research focuses on deep convolutional architectures, pixel-level optical processing, or automated robotics vision, these symposia in Shanghai, Kunming, and Hangzhou offer the perfect platform.
Location: Shanghai, China
Dates: August 14–16, 2026
Submission Deadline: June 15, 2026
Core Focus: Pattern recognition systems, computer vision, deep learning applications, face recognition, and cognitive systems.
Organizer: Shanghai Jiao Tong University
Indexing: EI Compendex, Scopus (Published by IEEE)
Official Website: https://www.prai.net/
Location: Kunming, China
Dates: July 17–19, 2026
Submission Deadline: June 5, 2026
Core Focus: Artificial neural networks, object detection and tracking, computational photography, and system computing.
Organizer: Kunming University of Science and Technology
Indexing: EI Compendex, Scopus (Published by IEEE)
Official Website: http://icivc.org/
Location: Hangzhou, China
Dates: March 19–21, 2027
Submission Deadline: November 1, 2026
Core Focus: 3D machine vision, camera sensor networks, robotics control algorithms, and modern automation pathways.
Indexing: EI Compendex, Scopus
Official Website: https://www.icrmv.org/
For researchers developing statistical learning frameworks, big data mining architectures, or cognitive computing models, Shenzhen and Chongqing host highly anticipated events.
Location: Shenzhen, China
Dates: February 26 – March 1, 2027
Submission Deadline: September 25, 2026
Core Focus: Statistical learning, data mining architectures, computational theory, and automated software agents.
Indexing: EI Compendex, Scopus
Official Website: http://www.icmlc.org
Location: Chongqing, China
Dates: March 19–21, 2027
Submission Deadline: September 30, 2026
Core Focus: Cognitive learning models, algorithmic optimization, mechanical controls, and neural decision-making pipelines.
Organizer: Chongqing University of Posts and Telecommunications
Indexing: EI Compendex, Scopus
Official Website: https://www.mlcc.net/
Location: Shenzhen, China
Dates: November 12–14, 2026
Submission Deadline: August 10, 2026
Core Focus: AI in wireless networking protocols, IoT communication networks, and information security algorithms.
Co-Organizers: Southeast University, Harbin Institute of Technology
Indexing: EI Compendex, Scopus
Official Website: http://www.ic-wcsp.org/2026
AI is rapidly transforming specialized sectors. These forums target the intersection of machine learning with medical diagnostics, decentralized ledgers, and intelligent tutoring.
Location: Shanghai, China
Dates: August 14–16, 2026
Submission Deadline: May 30, 2026
Core Focus: Machine learning in clinical diagnostics, medical imagery classification, and bio-signal extraction.
Organizer: Fudan University
Indexing: EI Compendex, Scopus (Published by IEEE)
Official Website: https://www.icbip.org/
Location: Shanghai, China
Dates: November 27–29, 2026
Submission Deadline: July 10, 2026
Core Focus: Security vulnerabilities in AI systems, smart contracts, decentralized ledger protocols, and trusted machine learning.
Indexing: EI Compendex, Scopus
Official Website: https://www.aibt.net/index.html
Location: Kunming, China
Dates: December 18–20, 2026
Submission Deadline: July 10, 2026
Core Focus: Artificial intelligence integrations in modern classrooms, adaptive curricula engines, and user-behavior modeling.
Organizer: Yunnan Normal University
Indexing: EI Compendex, Scopus
Official Website: https://www.aies.net/
Location: Chongqing, China
Dates: March 26–28, 2027
Submission Deadline: November 5, 2026
Core Focus: Smart tutoring, academic systems, software engineering in education, and educational data analytics.
Organizer: Southwest University
Indexing: EI Compendex, Scopus (Published by IEEE)
Official Website: http://www.iceit.org/
The backbone of all AI perception relies on robust signal computation.
Location: Changzhou, China
Dates: July 17–19, 2026
Submission Deadline: May 25, 2026
Core Focus: High-dimensional signals, image restoration, multi-spectral analysis, and compression methodologies.
Indexing: EI Compendex, Scopus (Published by IEEE)
Official Website: http://www.icsip.org/
The following reference table provides a consolidated timeline and the direct official links for these premier AI venues in China.
|
Conference Abbreviation |
Host City |
Event Dates |
Core Subject Focus |
Indexing |
Official Website Link (Direct) |
|---|---|---|---|---|---|
|
ICSIP 2026 |
Changzhou |
Jul 17–19, 2026 |
Signal & Image Processing |
EI, Scopus |
http://www.icsip.org/ |
|
ICIVC 2026 |
Kunming |
Jul 17–19, 2026 |
Computer Vision & Computing |
EI, Scopus |
http://icivc.org/ |
|
PRAI 2026 |
Shanghai |
Aug 14–16, 2026 |
AI & Pattern Recognition |
EI, Scopus |
https://www.prai.net/ |
|
ICBIP 2026 |
Shanghai |
Aug 14–16, 2026 |
Biomed Signal & AI |
EI, Scopus |
https://www.icbip.org/ |
|
WCSP 2026 |
Shenzhen |
Nov 12–14, 2026 |
Wireless Comms & Signals |
EI, Scopus |
http://www.ic-wcsp.org/2026 |
|
AIBT 2026 |
Shanghai |
Nov 27–29, 2026 |
AI & Blockchain Systems |
EI, Scopus |
https://www.aibt.net/index.html |
|
AIES 2026 |
Kunming |
Dec 18–20, 2026 |
AI & Education Systems |
EI, Scopus |
https://www.aies.net/ |
|
ICMLC 2027 |
Shenzhen |
Feb 26 – Mar 1, 2027 |
Machine Learning & Computing |
EI, Scopus |
http://www.icmlc.org |
|
MLCC 2027 |
Chongqing |
Mar 19–21, 2027 |
Machine Learning & Cognition |
EI, Scopus |
https://www.mlcc.net/ |
|
ICRMV 2027 |
Hangzhou |
Mar 19–21, 2027 |
Robotics & Machine Vision |
EI, Scopus |
https://www.icrmv.org/ |
|
ICEIT 2027 |
Chongqing |
Mar 26–28, 2027 |
Educational Info Technology |
EI, Scopus |
http://www.iceit.org/ |
To successfully navigate the peer-review process and secure your publication in IEEE Xplore, ACM DL, or SpringerLink, ensure you follow these strict guidelines:
Avoid Plagiarism at All Costs: Technical Program Committees in China heavily rely on iThenticate and CrossCheck. Ensure your total manuscript similarity is strictly < 15%, with no single source exceeding < 5%.
Utilize Publisher Templates: If the conference is sponsored by IEEE (like PRAI or ICIVC), you must format your paper strictly using the IEEE double-column template in MS Word or LaTeX.
Register on Time: Ensure your registration fees and camera-ready uploads are completed well before the final deadlines. Failure to present (even virtually) may result in your paper being pulled from the final EI Compendex indexing batch.