CONFERENCES NEWS

Where to Publish AI Papers in 2026? Top EI Indexed Conferences in China

2 views||Release time: Jun 04, 2026

For doctoral students, data scientists, and artificial intelligence researchers, finding the right venue to publish your latest algorithms or neural network models is critical. If you are asking yourself, "Where should I publish my AI papers in 2026?", targeting international conferences hosted in China is one of the most strategic moves you can make.

 Where to Publish AI Papers in 2026? Top EI Indexed Conferences in China

China has rapidly become the world's leading hub for artificial intelligence, computer vision, and machine learning research. Presenting your work at these premier academic symposia ensures rigorous double-blind peer review and secures your indexation in world-class databases, including EI Compendex and Scopus.

Below is your ultimate guide to 11 elite AI, machine learning, and intelligent computing conferences accepting submissions for 2026 and early 2027 across China's major tech hubs.

1. Core AI, Pattern Recognition & Computer Vision

If your research focuses on deep convolutional architectures, pixel-level optical processing, or automated robotics vision, these symposia in Shanghai, Kunming, and Hangzhou offer the perfect platform.

PRAI 2026: 9th International Conference on Pattern Recognition and Artificial Intelligence

  • Location: Shanghai, China

  • Dates: August 14–16, 2026

  • Submission Deadline: June 15, 2026

  • Core Focus: Pattern recognition systems, computer vision, deep learning applications, face recognition, and cognitive systems.

  • Organizer: Shanghai Jiao Tong University

  • Indexing: EI Compendex, Scopus (Published by IEEE)

  • Official Website: https://www.prai.net/

ICIVC 2026: 11th International Conference on Image, Vision and Computing

  • Location: Kunming, China

  • Dates: July 17–19, 2026

  • Submission Deadline: June 5, 2026

  • Core Focus: Artificial neural networks, object detection and tracking, computational photography, and system computing.

  • Organizer: Kunming University of Science and Technology

  • Indexing: EI Compendex, Scopus (Published by IEEE)

  • Official Website: http://icivc.org/

ICRMV 2027: 11th International Conference on Robotics and Machine Vision

  • Location: Hangzhou, China

  • Dates: March 19–21, 2027

  • Submission Deadline: November 1, 2026

  • Core Focus: 3D machine vision, camera sensor networks, robotics control algorithms, and modern automation pathways.

  • Indexing: EI Compendex, Scopus

  • Official Website: https://www.icrmv.org/

2. Machine Learning, Big Data & Cognitive Computing

For researchers developing statistical learning frameworks, big data mining architectures, or cognitive computing models, Shenzhen and Chongqing host highly anticipated events.

ICMLC 2027: 19th International Conference on Machine Learning and Computing

  • Location: Shenzhen, China

  • Dates: February 26 – March 1, 2027

  • Submission Deadline: September 25, 2026

  • Core Focus: Statistical learning, data mining architectures, computational theory, and automated software agents.

  • Indexing: EI Compendex, Scopus

  • Official Website: http://www.icmlc.org

MLCC 2027: 2027 International Conference on Machine Learning and Cognitive Computing

  • Location: Chongqing, China

  • Dates: March 19–21, 2027

  • Submission Deadline: September 30, 2026

  • Core Focus: Cognitive learning models, algorithmic optimization, mechanical controls, and neural decision-making pipelines.

  • Organizer: Chongqing University of Posts and Telecommunications

  • Indexing: EI Compendex, Scopus

  • Official Website: https://www.mlcc.net/

WCSP 2026: 18th International Conference on Wireless Communications and Signal Processing

  • Location: Shenzhen, China

  • Dates: November 12–14, 2026

  • Submission Deadline: August 10, 2026

  • Core Focus: AI in wireless networking protocols, IoT communication networks, and information security algorithms.

  • Co-Organizers: Southeast University, Harbin Institute of Technology

  • Indexing: EI Compendex, Scopus

  • Official Website: http://www.ic-wcsp.org/2026

3. Applied AI: Biomedicine, Blockchain & Education Systems

AI is rapidly transforming specialized sectors. These forums target the intersection of machine learning with medical diagnostics, decentralized ledgers, and intelligent tutoring.

ICBIP 2026: 11th International Conference on Biomedical Signal and Image Processing

  • Location: Shanghai, China

  • Dates: August 14–16, 2026

  • Submission Deadline: May 30, 2026

  • Core Focus: Machine learning in clinical diagnostics, medical imagery classification, and bio-signal extraction.

  • Organizer: Fudan University

  • Indexing: EI Compendex, Scopus (Published by IEEE)

  • Official Website: https://www.icbip.org/

AIBT 2026: 5th International Conference on Artificial Intelligence and Blockchain Technology

  • Location: Shanghai, China

  • Dates: November 27–29, 2026

  • Submission Deadline: July 10, 2026

  • Core Focus: Security vulnerabilities in AI systems, smart contracts, decentralized ledger protocols, and trusted machine learning.

  • Indexing: EI Compendex, Scopus

  • Official Website: https://www.aibt.net/index.html

AIES 2026: International Conference on Artificial Intelligence and Education Systems

  • Location: Kunming, China

  • Dates: December 18–20, 2026

  • Submission Deadline: July 10, 2026

  • Core Focus: Artificial intelligence integrations in modern classrooms, adaptive curricula engines, and user-behavior modeling.

  • Organizer: Yunnan Normal University

  • Indexing: EI Compendex, Scopus

  • Official Website: https://www.aies.net/

ICEIT 2027: 16th International Conference on Education and Information Technology

  • Location: Chongqing, China

  • Dates: March 26–28, 2027

  • Submission Deadline: November 5, 2026

  • Core Focus: Smart tutoring, academic systems, software engineering in education, and educational data analytics.

  • Organizer: Southwest University

  • Indexing: EI Compendex, Scopus (Published by IEEE)

  • Official Website: http://www.iceit.org/

4. Fundamental Signal & Information Processing

The backbone of all AI perception relies on robust signal computation.

ICSIP 2026: 11th International Conference on Signal and Image Processing

  • Location: Changzhou, China

  • Dates: July 17–19, 2026

  • Submission Deadline: May 25, 2026

  • Core Focus: High-dimensional signals, image restoration, multi-spectral analysis, and compression methodologies.

  • Indexing: EI Compendex, Scopus (Published by IEEE)

  • Official Website: http://www.icsip.org/

5. Quick Submission Matrix: AI Conferences in China (2026-2027)

The following reference table provides a consolidated timeline and the direct official links for these premier AI venues in China.

Conference Abbreviation

Host City

Event Dates

Core Subject Focus

Indexing

Official Website Link (Direct)

ICSIP 2026

Changzhou

Jul 17–19, 2026

Signal & Image Processing

EI, Scopus

http://www.icsip.org/

ICIVC 2026

Kunming

Jul 17–19, 2026

Computer Vision & Computing

EI, Scopus

http://icivc.org/

PRAI 2026

Shanghai

Aug 14–16, 2026

AI & Pattern Recognition

EI, Scopus

https://www.prai.net/

ICBIP 2026

Shanghai

Aug 14–16, 2026

Biomed Signal & AI

EI, Scopus

https://www.icbip.org/

WCSP 2026

Shenzhen

Nov 12–14, 2026

Wireless Comms & Signals

EI, Scopus

http://www.ic-wcsp.org/2026

AIBT 2026

Shanghai

Nov 27–29, 2026

AI & Blockchain Systems

EI, Scopus

https://www.aibt.net/index.html

AIES 2026

Kunming

Dec 18–20, 2026

AI & Education Systems

EI, Scopus

https://www.aies.net/

ICMLC 2027

Shenzhen

Feb 26 – Mar 1, 2027

Machine Learning & Computing

EI, Scopus

http://www.icmlc.org

MLCC 2027

Chongqing

Mar 19–21, 2027

Machine Learning & Cognition

EI, Scopus

https://www.mlcc.net/

ICRMV 2027

Hangzhou

Mar 19–21, 2027

Robotics & Machine Vision

EI, Scopus

https://www.icrmv.org/

ICEIT 2027

Chongqing

Mar 26–28, 2027

Educational Info Technology

EI, Scopus

http://www.iceit.org/

6. How to Guarantee Your EI Indexing in China

To successfully navigate the peer-review process and secure your publication in IEEE Xplore, ACM DL, or SpringerLink, ensure you follow these strict guidelines:

  1. Avoid Plagiarism at All Costs: Technical Program Committees in China heavily rely on iThenticate and CrossCheck. Ensure your total manuscript similarity is strictly < 15%, with no single source exceeding < 5%.

  2. Utilize Publisher Templates: If the conference is sponsored by IEEE (like PRAI or ICIVC), you must format your paper strictly using the IEEE double-column template in MS Word or LaTeX.

  3. Register on Time: Ensure your registration fees and camera-ready uploads are completed well before the final deadlines. Failure to present (even virtually) may result in your paper being pulled from the final EI Compendex indexing batch.

Hot Conferences

ICEIM 2026

Submission Deadline: Jun 25, 2026

2026 the 15th International Conference on Engineering and Innovative Materials

Aug 05-Aug 07, 2026

Japan

ICCUE 2026

Submission Deadline: Jun 05, 2026

2026 13th International Conference on Civil and Urban Engineering

Aug 27-Aug 29, 2026

Italy