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The (Guangdong-Hong Kong-Macao Greater Bay Area) and major mainland Chinese technology corridors have rapidly consolidated their positions as premier global epicenters for hardware manufacturing, 5G/6G communication research, and artificial intelligence deployment. Backed by elite academic institutions, these regions consistently host prestigious peer-reviewed international symposia.

For global computer scientists, communications engineers, and postgraduate scholars planning their 2026 and 2027 publication timelines, submitting research to these venues is a highly strategic career move. Every conference featured in this guide ensures robust double-blind peer-review standards and secures direct indexing in world-class repositories, including EI Compendex and Scopus.
Here is your definitive call-for-papers guide to 12 top-tier IT, computing, and communication conferences.
These premium forums, situated in the heart of the Greater Bay Area, highlight breakthroughs in circuit systems, signal transmission, computing intelligence, and structural construction materials.
Location: Hong Kong, China
Dates: February 18–21, 2027
Submission Deadline: September 25, 2026
Key Scopes: Advanced structural computing materials, intelligent manufacturing, structural mechanics, and civil engineering frameworks.
Joint Organizers: Macau University of Science and Technology, City University of Hong Kong
Indexing: EI Compendex, Scopus
Official Website: https://www.icbmc.org/
Location: Shenzhen, China
Dates: November 12–14, 2026
Submission Deadline: August 10, 2026
Key Scopes: Next-generation wireless networks, IoT communications, signal processing algorithms, and information theory.
Joint Organizers: Southeast University, Harbin Institute of Technology
Indexing: EI Compendex, Scopus
Official Website: http://www.ic-wcsp.org/2026
Location: Shenzhen, China
Dates: February 26 – March 1, 2027
Submission Deadline: September 25, 2026
Key Scopes: Computational learning theory, deep neural network frameworks, smart robotic controls, and intelligent agent systems.
Indexing: EI Compendex, Scopus
Official Website: http://www.icmlc.org
These elite conferences highlight pixel-level analytics, multidimensional signal modeling, and advanced convolutional architecture engineering.
Location: Shanghai, China
Dates: August 14–16, 2026
Submission Deadline: June 15, 2026
Key Scopes: Deep learning-based visual analysis, face recognition, object classification, and supervised/unsupervised pattern matching.
Organizer: Shanghai Jiao Tong University
Indexing: EI Compendex, Scopus (Published by IEEE)
Official Website: https://www.prai.net/
Location: Changzhou, China
Dates: July 17–19, 2026
Submission Deadline: May 25, 2026
Key Scopes: Image processing, radar signal analytics, biomathematical models, and multi-sensor data fusion.
Indexing: EI Compendex, Scopus (Published by IEEE)
Official Website: http://www.icsip.org/
Location: Kunming, China
Dates: July 17–19, 2026
Submission Deadline: June 5, 2026
Key Scopes: Real-time visual tracking, image compression, virtual reality engines, and cloud-based graphics computation.
Joint Organizers: Kunming University of Science and Technology, IEEE
Indexing: EI Compendex, Scopus (Published by IEEE)
Official Website: http://icivc.org/
Location: Shanghai, China
Dates: August 14–16, 2026
Submission Deadline: May 30, 2026
Key Scopes: Medical diagnostics computing, clinical signal models, biosensor data extraction, and visual hardware acceleration.
Organizer: Fudan University
Indexing: EI Compendex, Scopus (Published by IEEE)
Official Website: https://www.icbip.org/
Addressing the convergence of decentralized ledgers, adaptive educational algorithms, and solid-state communications.
Location: Shanghai, China
Dates: November 27–29, 2026
Submission Deadline: July 10, 2026
Key Scopes: Smart contracts, decentralized ledger protocols, security vulnerabilities in AI systems, and machine learning models.
Indexing: EI Compendex, Scopus
Official Website: https://www.aibt.net/index.html
Location: Kunming, China
Dates: December 18–20, 2026
Submission Deadline: July 10, 2026
Key Scopes: AI tutor networks, user-behavior modeling, adaptive curriculum designs, and digital classroom security.
Organizer: Yunnan Normal University
Indexing: EI Compendex, Scopus
Official Website: https://www.aies.net/
Location: Xi'an, China
Dates: December 26–28, 2026
Submission Deadline: June 20, 2026
Key Scopes: Telecommunication arrays, solid-state electronics, smart sensors, and structural communications.
Organizer: Xi'an Polytechnic University
Indexing: EI Compendex, Scopus
Official Website: https://www.icece.net/
Location: Chongqing, China
Dates: March 26–28, 2027
Submission Deadline: November 5, 2026
Key Scopes: E-learning platforms, academic systems, software engineering in education, and smart tutoring.
Organizer: Southwest University
Indexing: EI Compendex, Scopus (Published by IEEE)
Official Website: http://www.iceit.org/
Location: Chongqing, China
Dates: March 19–21, 2027
Submission Deadline: September 30, 2026
Key Scopes: Cognitive learning models, algorithmic optimization, mechanical controls, and automated agents.
Organizer: Chongqing University of Posts and Telecommunications
Indexing: EI Compendex, Scopus
Official Website: https://www.mlcc.net/
Use the quick-reference matrix below to compare submission timelines and directly access the official websites.
|
Conference Abbreviation |
Venue City |
Event Dates |
Core Subject Focus |
Indexing |
Official Website Link (Direct) |
|---|---|---|---|---|---|
|
ICIVC 2026 |
Kunming |
Jul 17–19, 2026 |
Computer Vision & Graphics |
EI, Scopus |
http://icivc.org/ |
|
ICSIP 2026 |
Changzhou |
Jul 17–19, 2026 |
Signal & Image Processing |
EI, Scopus |
http://www.icsip.org/ |
|
PRAI 2026 |
Shanghai |
Aug 14–16, 2026 |
AI & Pattern Recognition |
EI, Scopus |
https://www.prai.net/ |
|
ICBIP 2026 |
Shanghai |
Aug 14–16, 2026 |
Biomed Signal Processing |
EI, Scopus |
https://www.icbip.org/ |
|
WCSP 2026 |
Shenzhen |
Nov 12–14, 2026 |
Wireless Communications |
EI, Scopus |
http://www.ic-wcsp.org/2026 |
|
AIBT 2026 |
Shanghai |
Nov 27–29, 2026 |
AI & Blockchain Systems |
EI, Scopus |
https://www.aibt.net/index.html |
|
AIES 2026 |
Kunming |
Dec 18–20, 2026 |
AI & Education Systems |
EI, Scopus |
https://www.aies.net/ |
|
ICECE 2026 |
Xi'an |
Dec 26–28, 2026 |
Electronics & Communication |
EI, Scopus |
https://www.icece.net/ |
|
ICBMC 2027 |
Hong Kong |
Feb 18–21, 2027 |
Building Materials & Civil Eng |
EI, Scopus |
https://www.icbmc.org/ |
|
ICMLC 2027 |
Shenzhen |
Feb 26 – Mar 1, 2027 |
Machine Learning & Computing |
EI, Scopus |
http://www.icmlc.org |
|
MLCC 2027 |
Chongqing |
Mar 19–21, 2027 |
Machine Learning & Cognition |
EI, Scopus |
https://www.mlcc.net/ |
|
ICEIT 2027 |
Chongqing |
Mar 26–28, 2027 |
Educational Info Technology |
EI, Scopus |
http://www.iceit.org/ |