==Submission Deadline: (For early submission, it will get the feedback within 1month) ==Publication: Conference Proceeding ==Indexed by: IEEE Xplore，Ei Compendex, and Scopus* ==Submission email:icicm@young.ac.cn (Or you still can submit to the submission system on website) ==Find the tempalte with the link:http://www.icicm.net/Template.doc ★ICICM Committees★ ★Advisory Chairs: Prof. Degang James Chen, IEEE Fellow, Iowa State University, USA; Prof. Meng-Fan (Marvin) CHANG, National Tsing Hua University (NTHU), Taiwan. ★Conference Chairs: Prof. Zhigong Wang, Southeast University, China; Prof. Li Qiang, University of Electronic Science and Technology of China, China. ★Conference Co-Chair: Prof. Gene Eu Jan, National Taipei University, Taiwan ★Program Chairs: Prof. Fei Yuan, Ryerson University, Canada; Prof. Zhi-Jian Xie, North Carolina A&T State University, USA. ★Steering Committee Chair: Prof. Huang Le Tian, University of Electronic Science and Technology of China, China ★Technical Committee: Prof. Bo Yan, University of Electronic Science & Technology of China, China; Prof. Dr. Ashutosh Kumar Singh, National Institute of Technology, Kurukshetra, India; Prof. Xiaoxiao Wang, BeiHang University, China; Prof. Changchun Zhang, Shanghai University of Posts and Telecommunication / Southeast University, China; Prof. Jinzhao Wu, Guangxi University for Nationalities, China; Prof. Shiwei Feng, Beijing University of Technology, China; Assoc. Prof. Wei Ni, Hefei University of Technology, China; Assoc. Prof. Xingyuan Tong, Xi'an University of Posts & Telecommunications, China; Assis. Prof. Li Jiang, Shanghai Jiao Tong University, China; Prof. Jinyan Wang, Peking University, China; Prof. Zhi-Jian Xie, NC A&T State University, USA; Prof. S. Ushakumari, College of Engineering Trivandrum, India; Prof. Lu Tang, Southeast University, China; Prof. Haizhi Song, University of Electronic Science and Technology of China, China; Prof. Tang Bin, Chengdu Aeronautic Polytechnic, The Innovation Base of School-Enterprise Cooperation Aviation Electronic Technology in Sichuan, China; Prof. Shiwei Feng, Beijing University of Technology,China; For more members, please visite conference website: http://www.icicm.net/committee.html ★★History: <ICICM2016|IEEE Publisher|Chengdu,China|Nov.23-25, 2016 > Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus! Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3 <ICICM2017|IEEE Publisher|Nanjing,China|Nov.8-11,2017> Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus! Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0 <ICIC2018|IEEE Publisher|Shanghai,China|Nov.24-26, 2018> Papers of ICICM2018 can be checked in IEEE Xplore now! Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5 ★TOPICS: Digital, Analog, Mixed Signal IC and SOC design technology Silicon integrated circuits and manufacturing Low-power, RF devices & circuits IC Computer-Aided –Design technology, DFM Silicon/germanium devices and device physics Interconnect, Low K, High K and other process technologies Unconventional and nano-electronics Organic semiconductor devices and technologies Compound semiconductor devices and circuits Displays, sensors and MEMS Semiconductor materials and material characterization Packaging and testing technology Solar cell & other devices for new energy sources Modeling and simulation Equipment technology Reliability Displays, sensors and MEMS Advance memories technology (Flash, FeRAM, PCM，ReRAM, MRAM etc.) ★Support: 1, Technical Support from IEEE 2, Sponsored by University of Electronic Science and Technology of China and Southeast University, China