Full Name: 2021 5th International Conference on Sensors, Materials and Manufacturing Abbreviation: ICSMM 2021 *Title: 2021 5th International Conference on Sensors, Materials and Manufacturing -- EI Compendex & Scopus *Date&location: November 19-21, 2021 & University of Macau, China *Website: www.icsmm.org 1. Publication: The registered and presented papers will be published in Materials Science Forum (ISSN print 0255-5476 / ISSN web 1662-9752), which will be indexed by Ei Compendex, Scopus. 2. Pulibcation History: ICSMM 2020 Key Engineering Materials: Volume 891. [ISBN: 978-3-0357-1789-1] (will be indexed soon...) ICSMM 2019 Solid State Phenomena: Volume 305. [ISBN: 978-3-0357-1657-3] (Ei Compendex & Scopus) ICSMM 2018 Material Science Forum: Volume 962. [ISBN: 978-3-0357-1416-6] (Ei Compendex & Scopus) ICSMM 2017 IOP Conference Series: Materials Science and Engineering, VoL.311. (Ei Compendex & Scopus) 3. Speakers: * Prof. Kwang Leong Choy, University College London, UK * Prof. Hui Pan, University of Macau (UM), China * Prof. Feng Xing, Shenzhen University, China * Prof. Shen-Ming Chen, National Taipei University of Technology, Taiwan * Prof. Han-Yong Jeon, Inha University, South Korea 4. Submission Methods: Two kinds of proposals are accepted: Abstract for oral presenation & Full paper for publication and oral presentation.(English Only) * System submission: http://confsys.iconf.org/submission/icsmm2021 * Email submission: icsmm@cbees.net For submission guidline, please visit: http://www.icsmm.org/sub.html 5. Conference Topics: * New Materials and Advanced Materials * Materials Processing Engineering * Electronic Materials * Sensor Technology For more topics, please visit: http://www.icsmm.org/cfp.html 6. Contact us: Ms. Elva Zhang Tel: +86-28-87577778 E-mail: icsmm@cbees.net Website: www.icsmm.org