IOP--2021 The 4th International Conference on Smart Materials Applications (ICSMA 2021)--EI Compendex, Scopus The 4th International Conference on Smart Materials Applications (ICSMA 2021) will take place in Bangkok, Thailand during January 12-14, 2021. ICSMA2021 is co-organized by South Asia Institute of Science and Engineering (SAISE) and Sichuan University, China and Yonsei University,South Korea. More details, please visit: http://www.icsma.org ★ Conference Proceedings： All submissions will be peer reviewed, the registered and presented papers will be published into ICSMA Conference Proceedings by IOP, which will indexed by Ei Compendex, Scopus, Thomson Reuters (WoS), Inspec,et al. ICSMA 2020 - IOP Conference Series: Materials Science and Engineering to be informed ICSMA 2019 - IOP Conference Series: Materials Science and Engineering Vol. 559 | Ei Compendex, Scopus ICSMA 2018 - IOP Conference Series: Materials Science and Engineering Vol. 422 | Ei Compendex, Scopus ★ Previous ICSMA, Please kindly check:http://www.icsma.org/icsma2020.html ★ Keynote Speakers: ☆Prof. Michael D. Guiver | Tianjin University, China； ☆ Prof. Ki Bong Lee | Korea University, South Korea； ☆ Prof. Xiaohong Zhu | Sichuan University, China。 ★ Call for Papers: Topics of interest for submission include, but are not limited to: Materials Science and Engineering Metallic Alloys, Tool Materials, Superplastic Materials, Ceramics and Glasses, Composites, Amorphous Materials, Nano-materials, Biomaterials, Multifunctional Materials, Smart Materials, Engineering Polymers, Functional materials, Nuclear fuel materials, Biomaterials, sensors and surfaces, Thin Film Chalcogenide Photovoltaic Materials, Nuclear Materials IV, Magnetic Materials, Multi Functional Magnetic Materials, Superconducting Materials, Structured Materials, Spintronics Materials and Devices, Hard/Soft Magnetic Materials, Crosscutting materials Materials Properties, Measuring Methods and Applications Ductility, Crack Resistance, Fatigue, Creep-resistance, Fracture Mechanics, Mechanical Properties, Electrical Properties, and Magnetic Properties, Corrosion, Erosion, Wear Resistance, Non-Destructive Testing, Reliability Assessment, Toxicity, Working Properties of Materials and Products, Large Scale Applications, Electronics Applications Methodology of Research and Analysis and Modeling Electron Microscopy, X-ray Phase Analysis, Metallographic, Quantitative Metallographic, Image Analysis, Computer Assistance in the Engineering Tasks and Scientific Research, Numerical Techniques, Statistic Methods, Residual Life Analysis, Process Systems Design, Mould Flow Analysis, Rapid Prototyping, CAM, CAMS, CAQ, Engineering Design, Technological Design, Materials Design, Computational Material Science, Materials and Engineering Databases, Expert Systems, Artificial Intelligence Methods Materials Manufacturing and Processing Casting, Powder Metallurgy, Welding, Sintering, Heat Treatment, Thermo-Chemical Treatment, Thin & Thick Coatings, Surface Treatment, Machining, Plastic Forming, Quality Assessment, Automation Engineering Processes, Robotics, Mechatronics, Technological Devices and Equipment, Theoretical Fundamentals of Cleaner Production, Industrial Application of Cleaner Production Methods, Production and Operations Management, Production Planning and Control, Manufacturing Technology Management, Quality Management, Environmental Management, Safety and Health Management, Project Management, Physical Distribution and Logistics Management, Supply Chain Management, Productivity and Performance Management For more topics, please visit http:http://www.icsma.org/cfp.html ★Submission Methods: 1. Template Download: Full-Papers-Template: http://www.icsma.org/IOP-Template.doc Abstract-Template: http://www.icsma.org/Abstract-Template.doc 2.Steps for Paper Submission: Create an iconf. account. (For new user), Click on the following link URL : http://confsys.iconf.org/submission/icsma2021 Enter iconf. user name and password Go to new submission Fill the details and upload the paper / abstract in pdf Only Full paper submission will be published in conference proceedings if accepted. Wait for the response from ICSMA 2021 Team For any inquiry about the conference, please feel free to contact us at: icsma@saise.org. ★ You can also submit your paper to us by email: icsma@saise.org. ★ Contact Us： Ms. Chelsea Wang Conference Secretary of ICSMA (1) Email: icsma@saise.org (2) Tel: +852-30717761 (Hong Kong) / +86-18062000004 (China) (Office Time 9:30 - 18:00, GMT+8, Monday to Friday)