CONFERENCES

ICICM 2024
0

2024 The 9th International Conference on Integrated Circuits and Microsystems

posted by organizer: ||251 views||Release time:Oct 16, 2024

Conference DateOct 25-Oct 27, 2024PlaceWuhan, China
Submission DeadlineSep 20, 2024E-mailicicm_conf@vip.163.com
Websitehttp://icicm.net/Telephone (86)134-0855-5552
DESCRIPTION
★ICICM2024--Ei Compendex,Scopus--Wuhan, China★ ★Full name: 2024 The 9th International Conference on Integrated Circuits and Microsystems ★Abbreviation: ICICM 2024 **Place: Wuhan, China **Time: October 25-27, 2024 **Website: http://icicm.net/ ★Co-Sponsored by: ==Southeast University, China ==University of Electronic Science and Technology of China, China ==Wuhan University of Technology, China ==Submission== 1. Full paper (publication and presentation) 2. Abstract (presentation only) Electronic submission system: https://easychair.org/conferences/?conf=icicm2024 Email submission: icicm_conf@vip.163.com More detail about submission, please visit at http://icicm.net/submission.html =Publication= The accepted and registered papers will be publication in Conference Proceedings, included in IEEE Xplore, which will be indexed by EI Compendex, Scopus, etc. ***ICICM2016-2023 has been successfully indexed by EI Compendex and Scopus already! =Topics (include but not limit)= ► Devices and Circuits for Wirless System ► Application Specific Circuits and Systems for Communication ► Digital, Analog, Mixed Signal IC and SOC design technology ► Silicon integrated circuits and manufacturing ► Low-power, RF devices & circuits ► IC Computer-Aided –Design technology, DFM ► Silicon/germanium devices and device physics ► Interconnect, Low K, High K and other process technologies ► Unconventional and nano-electronics ► Organic semiconductor devices and technologies ► Compound semiconductor devices and circuits ► Displays, sensors and MEMS ► Semiconductor materials and material characterization ► Packaging and testing technology ► Solar cell & other devices for new energy sources ► Modeling and simulation ► Equipment technology ► Reliability ► Displays, sensors and MEMS ► Advance memories technology For more topics, please visit at: http://icicm.net/call-for-papers.html ==Organizing Committee== Advisory Chairs: Junfa Mao, Shenzhen University, China; Yue Hao, Xidian University, China. Conference Chairs: Zhigong Wang, Southeast University, China; Ning Xu, Wuhan University of Technology, China. Conference Co-Chairs: Yu Wang,Tsinghua University,China; Letian Huang, University of Electronic Science and Technology of China, China. Program Chairs: Jiliang Zhang, Hunan University, China; Ying Wang, Institute of Computing Technology, Chinese Academy of Sciences, China; Sheng Chang, Wuhan University, China; Yingmei Chen, Southeast University, China; Xiulong Wu, Anhui University, China; Zhikuang Cai, Nanjing University of Posts and Telecommunications, China; Zhuo Zou, Fudan University, China; Jianguo Hu, Sun Yat-sen University , China; Bei Yu,The Chinese University of Hong Kong, China. Program Co-Chairs: Junyong Deng, Xi'an University of Posts & Telecommunications, China; Jun Xu, Nanjing University, China; Zhixiong Di, Southwest Jiaotong University, China; Guojie Luo, Peking University, China; Xiaojun Zhai, University of Essex, UK; Wei Xing, The University of Sheffield, UK. Program Committee: Shi Pu, Wuhan University of Technology , China; Haizhi Song, University Of Electronic Science And Technology Of China, China; Lu Zhu, Sun Yat-sen University, China; Youming Zhang, Southeast University, China; Jianshi Tang, Tsinghua University, China; Weiguang Sheng, Shanghai Jiao Tong University, China; Hao Gao, Austria & Eindhoven University of Technology, The Netherland; Yun Fang, Silicon Austria Labs, Austria; Jeff Kilby, Auckland University of Technology, New Zealand; Zhijun Zhou, Southeast University, China; Xingyuan Tong, Xi`an University Of Posts & Telecommunications, China; Wei Hu, Northwestern Polytechnical University, China. Local Chair: Bowen Jia, Wuhan University of Technology , China. Student Program Chairs: Keping Wang, Tianjin University, China; Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, China; Fanyi Meng, Tianjin University, China. Student Program Committee: Li Du, Nanjing University, China; Lei Wang, Nanjing University Of Posts And Telecommunications, China; Xianbo Li, Sun Yat-sen University, China; Tiehu Li, Chongqing University of Technology, China; Moufu Kong, University of Electronic Science and Technology of China, China; Jiaxin Liu, University of Electronic Science and Technology of China, China; Maliang Liu, Xidian University, China. More Organizing Committee list, please visit: https://icicm.net/committee.html ==History== ICICM2016 | Chengdu on November 23-25, 2016 ICICM2017 | Nanjing on November 8-11, 2017 ICICM2018 | Shanghai on November 24-26, 2018 ICICM2019 | Beijing on October 25-27,2019 ICICM2020 | Nanjing on October 23-25, 2020 ICICM2021 | Nanjing on October 22-24, 2021 ICICM2022 | Xi'an on October 28-31, 2022 ICICM2023 | Nanjing on October 20-23, 2023 =CONTACT US= Ms. Jenny Chow Email: icicm_conf@vip.163.com Web: http://icicm.net/ Tel: (86)134-0855-5552

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