【IEEE Official List Event--ICICM 2023】 ★ICICM 2023--IEEE|Ei Compendex,Scopus--Nanjing, China★ ★Full name: 2023 The 8th International Conference on Integrated Circuits and Microsystems ★Abbreviation: ICICM 2023 **Place: Nanjing, China **Time: October 20-23, 2023 **Website: http://icicm.net/ ★Co-Sponsored by: ==Southeast University, China ==University of Electronic Science and Technology of China, China ==Nanjing University of Posts and Telecommunications, China ==IEEE ==CAS ==Submission== 1. Full paper (publication and presentation) 2. Abstract (presentation only) Electronic submission system: https://easychair.org/conferences/?conf=icicm2023 Email submission: icicm_conf@vip.163.com More detail about submission, please visit at http://icicm.net/submission.html =Publication= The accepted and registered papers will be publication in IEEE Conference Proceedings, included in IEEE Xplore, which will be indexed by EI Compendex, Scopus, etc. ***ICICM 2016-2022 has been successfully indexed by EI Compendex and Scopus already! ***ICICM 2023 has been listed in IEEE Offcial Event List. =Topics (include but not limit)= ► Thz and Microwave MicroSystem ► Devices and Circuits for Wirless System ► Application Specific Circuits and Systems for Communication ► Digital, Analog, Mixed Signal IC and SOC design technology ► Silicon integrated circuits and manufacturing ► Low-power, RF devices & circuits ► IC Computer-Aided –Design technology, DFM ► Silicon/germanium devices and device physics ► Interconnect, Low K, High K and other process technologies ► Unconventional and nano-electronics ► Organic semiconductor devices and technologies ► Compound semiconductor devices and circuits ► Displays, sensors and MEMS ► Semiconductor materials and material characterization ► Packaging and testing technology ► Solar cell & other devices for new energy sources ► Modeling and simulation ► Equipment technology ► Reliability ► Displays, sensors and MEMS ► Advance memories technology For more topics, please visit at: http://icicm.net/call-for-papers.html ==Organizing Committee== **Advisory Chair: Pui-in Mak, University of Macau, Macau, China; Ljiljana Trajkovic, Simon Fraser University, Canada. **Conference Chairs: Zhigong Wang, Southeast University, China; Chen Liu, Nanjing University of Posts and Telecommunications, China; Li Qiang, University of Electronic Science and Technology of China, China. **Conference Co-Chairs: Yufeng Guo, Nanjing University of Posts and Telecommunications, China; Letian Huang, University of Electronic Science and Technology of China, China. **Program Chairs: Zhikuang Cai, Nanjing University of Posts and Telecommunications, China; Junyong Deng, Xi'an University of Posts & Telecommunications. **Program Co-Chairs: Zhixiong Di, Southwest Jiaotong University, China; Delong Shang, Insitute of Microelectronics of the Chinese Academy of Sciences, China; Abdel-Hamid Ali Soliman, Staffordshire University, UK; Alex Yakovlev, Newcastle University, UK. **Program Committee: Lu Zhu, Sun Yat-sen University, China; Youming Zhang, Southeast University, China; Weiguang Sheng, Shanghai Jiao Tong University, China; Haizhi Song, University of Electronic Science and Technology of China,China; Hao Gao, Austria & Eindhoven University of Technology, The Netherland; Yun Fang, Silicon Austria Labs, Austria; Jeff Kilby, Auckland University of Technology, New Zealand. **Student Program Chairs: Shiheng Yang, University of Electronic Science and Technology of China, China; Chao Fan, Xi'an Jiaotong University, China. **Special Session Chairs: Chen Yang, Xi'an Jiaotong University, China; Jianshi Tang, Tsinghua University, China; Yuan Du, Nanjing University, China. **Academic Committee Chairs: Jin He, Peking University, China; Fanyi Meng, Tianjin University, China. **Academic Committee: Kailin Ren, Shanghai University, China; Yuanyuan Shi, University of Science and Technology of China, China; Minghui Li, University of Glasgow, UK; Wang Nan, Dalian University of Technology, China; Wu Gao, Northwestern Polytechnical University, China. **Publicity Chairs: Huizhen Qian, University of Electronic Science and Technology of China, China; Qiang Wu, Southwest Jiaotong University, China; Jia Wang, Northwestern Polytechnical University, China; Dengquan Li, Xidian University, China; Pakornkiat Sawetmethikul, Rajamangala University of Technology Thanyaburi, Thailand; Wei Ren, Xi’an University of Posts and Telecommunications, China. ==History== ICICM2016 | Chengdu on November 23-25, 2016 ICICM2017 | Nanjing on November 8-11, 2017 ICICM2018 | Shanghai on November 24-26, 2018 ICICM2019 | Beijing on October 25-27,2019 ICICM2020 | Nanjing on October 23-25, 2020 ICICM2021 | Nanjing on October 22-24, 2021 ICICM2022 | Xi'an on October 28-31, 2022 =CONTACT US= Ms. Jenny Chow Email: icicm_conf@vip.163.com Web: http://icicm.net/ Tel: (86)136-2777-7774