★ICICM 2021--IEEE Xplore，Ei Compendex and Scopus★ Full Name: 2021 The 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)--EI Compendex, Scopus Abbreviation: ICICM 2021 Time: October 22-24, 2021 Place: Nanjing,China Website: http://www.icicm.net/ ==Submission Deadline: (For early submission, it will get the feedback within 1 month) ==Publication: Conference Proceeding ==Indexed by: Ei Compendex, and Scopus, etc. ==Submission email: icicm@young.ac.cn (Or you still can submit to the submission system https://easychair.org/conferences/?conf=icicm2021) ==Find the tempalte with the link: http://icicm.net/files/Template.doc ★Co-sponsored by★ University of Electronic Science and Technology of China, China Technology of China and Southeast University, China ★ICICM Committees★ Advisory Chairs: David Z. Pan, The University of Texas at Austin, United States (IEEE Fellow, SPIE Fellow); Ljiljana Trajkovic, Simon Fraser University, Canada (IEEE Fellow). Conference Chairs: Zhigong Wang, Southeast University, China; Li Qiang, University of Electronic Science and Technology of China, China(Founding Chair of IEEE Chengdu SSCS/CASS Joint Chapter). Program Chairs: Fei Yuan, Ryerson University, Canada(Senior Member of IEEE and IET Fellow); Zou Zhuo, Fudan University, China(Senior Member of IEEE); Liu Dake, Beijing Institute of Technology, China | Linköping University, Sweden. Steering Committee Chair: Huang Le Tian, University of Electronic Science and Technology of China, China Technical Committee: Zhenhai Chen, Hefei University of Technology, China; Junji Cheng, University of Electronic Science and Technology of China, China; Pan Dai, Huzhou University, China; Quanzhen Duan, Tianjin University of Technology, China; Hossein Fariborzi, King Abdullah University of Science and Technology, Saudi Arabia; Shengming Huang, Tianjin University of Technology, China; Sheng-Lyang Jang, National Taiwan University of Science and Technology, Taiwan; Xiangliang Jin, Hunan Normal University, China; Biba Josef, Universität der Bundeswehr München, Germany; Atsushi Kurokawa, Hirosaki University, Japan; Wen Cheng Lai, National Taiwan University of Science and Technology, Taiwan; Qi Li, Guilin University of Electronic Technology, China; Weiguang Sheng, Shanghai Jiao Tong University, China; Chunyi Song, Zhejiang University, China; Haizhi Song, University of Electronic Science and Technology of China, China; Jiajia Sun, China Academy of Space Technology, China; Lu Tang, Southeast University, China; Somboon Theerawisitpong, Rajamangala University of Technology Thanyaburi, Thailand; Wensi Wang, Beijing University of Technology, China; Weilin Xu, Guilin University of Electronic Technology, China; Jong-Ryul Yang, Yeungnam University, South Korea; Changchun Zhang, Nanjing University of Posts and Telecommunications, China. For more members, please visite conference website: http://www.icicm.net/committee.html ★History★ <ICICM2020 | IEEE Publisher | Nanjing,China | October 23-25, 2020> Papers of ICICM2020 can be checked in IEEE Xplore! Electronic ISBN: 978-1-7281-8978-9 | USB ISBN: 978-1-7281-8977-2 <ICICM2019 | IEEE Publisher | Beijing, China | October 25-27, 2019> Papers of ICICM2019 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus! Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1 <ICICM2018|IEEE Publisher|Shanghai,China|Nov.24-26, 2018> Papers of ICICM2018 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus! Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5 <ICICM2017|IEEE Publisher|Nanjing,China|Nov.8-11,2017> Papers of ICICM2017 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus! Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0 <ICICM2016|IEEE Publisher|Chengdu,China|Nov.23-25, 2016 > Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus! Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3 ★Topics★ Digital, Analog, Mixed Signal IC and SOC design technology Silicon integrated circuits and manufacturing Low-power, RF devices & circuits IC Computer-Aided –Design technology, DFM Silicon/germanium devices and device physics Interconnect, Low K, High K and other process technologies Unconventional and nano-electronics Organic semiconductor devices and technologies Compound semiconductor devices and circuits Displays, sensors and MEMS Semiconductor materials and material characterization Packaging and testing technology Solar cell & other devices for new energy sources Modeling and simulation Equipment technology Reliability Displays, sensors and MEMS Advance memories technology (Flash, FeRAM, PCM，ReRAM, MRAM etc.) ★Conference Contact★ Ms Zeng Email: icicm@young.ac.cn Tel: +86-28-87777577 Web: www.icicm.net