ICICM 2020--IEEE Xplore，Ei Compendex and Scopus IEEE--2020 The 5th International Conference on Integrated Circuits and Microsystems (ICICM 2020)--Ei Compendex, Scopus, and CPCI Time: October 23-25, 2020 Place: Nanjing, China http://www.icicm.net/ ==Publication: All accepted papers after proper presentation and registration will be collected in the IEEE conference proceedings, which will be submitted and reviewed in the IEEE Xplore, Ei Compendex, Scopus, and CPCI (Web of Science) after the conference. ==Submission email:icicm@young.ac.cn (Or you still can submit to the submission system on website) ==Find the tempalte with the link: http://icicm.net/Template.doc (Word) http://icicm.net/WIN-or-MAC-LaTeX2e-Transactions-Style-File.zip (Latex) ★Keynote Speakers: Prof. Ljiljana Trajkovic, IEEE Fellow,Simon Fraser University, Canada; Prof. Fei Yuan，Ryerson University, Canada. ★Invited Speakers: Prof. Sheng-Lyang Jang,National Taiwan University of Science and Technology, Taiwan; Prof. Dai Yong-Sheng,Nanjing University of science & Technology, China. ★ICICM Committees: Advisory Chair: Prof. Ljiljana Trajkovic, IEEE Fellow, Simon Fraser University, Canada Conference Chairs: Prof. Zhigong Wang, Southeast University, China; Prof. Li Qiang, University of Electronic Science and Technology of China, China; Prof. Gene Eu Jan, National Taipei University, Taiwan. Program Chairs: Prof. Fei Yuan, Ryerson University, Canada; Prof. Zou Zhuo, Fudan University, China; Prof. Liu Dake, Beijing Institute of Technology, China | Link?ping University, Sweden; Assoc. Prof. Keping Wang, Southeast University, China. Steering Committee Chairs: Prof. Huang Le Tian, University of Electronic Science and Technology of China, China; Prof. Dai Yong-Sheng, Nanjing University of Science & Technology, China; Prof. Sheng-Lyang Jang, National Taiwan University of Science and Technology, Taiwan. Technical Committee: Prof. Xiaoxiao Wang, BeiHang University, China; Prof. Bo Yan, University of Electronic Science & Technology of China, China; Prof. Dr. Ashutosh Kumar Singh, National Institute of Technology, Kurukshetra, India; Assis. Prof. Hossein Fariborzi, King Abdullah University of Science and Technology, Saudi Arabia; Assoc. Prof. Hamed Alipour-Banaei, Islamic Azad University, Iran; Assoc. Prof. Tiejun Chen, Yiyang Medical College, China; Assis. Prof. Weiguang Sheng, Shanghai Jiao Tong University, China; Prof. Changchun Zhang, Shanghai University of Posts and Telecommunication / Southeast University, China; Assis. Prof. Yu Bai, California State University Fullerton, USA; Prof. Jinzhao Wu, Guangxi University for Nationalities, China; Prof. Shiwei Feng, Beijing University of Technology, China; Assoc. Prof. Wei Ni, Hefei University of Technology, China; Prof. Xingyuan Tong, Xi'an University of Posts & Telecommunications,China; Prof. Jinyan Wang, Peking University, China; Prof. Zhi-Jian Xie, NC A&T State University, USA; Prof. S. Ushakumari, College of Engineering Trivandrum, India; Prof. Lu Tang, Southeast University, China; Prof. Haizhi Song, University of Electronic Science and Technology of China, China; Prof. Tang Bin, Chengdu Aeronautic Polytechnic, The Innovation Base of School-Enterprise Cooperation Aviation Electronic Technology in Sichuan, China; Prof. Shiwei Feng, Beijing University of Technology,China; Assoc.Prof. Quanzhen Duan,Tianjin University of Technology, China; Assoc.Prof. Yue Ming Ding,Tianjin University of Technology,China; Prof.Shengming Huang,Tianjin University of Technology, China; Prof. Fei Yuan, Ryerson University, Canada; Assoc. Prof. Guolin Sun, Beihang University, China; Assoc. Prof. Yuan-Hao Huang, National Tsing Hua University,Taiwan; Asst. Prof. Dr. Najam Muhammad Amin, Bahria University, Pakistan; Prof. Dr.Qifeng Xu, Fuzhou University, China. For more members, please visit conference website: http://www.icicm.net/committee.html ★History: <ICIC2019|IEEE Publisher|Beijing,China|October 25-27, 2019> Papers of ICICM2019 can be checked in IEEE Xplore! Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1 <ICIC2018|IEEE Publisher|Shanghai,China|Nov.24-26, 2018> Papers of ICICM2018 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus! Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5 <ICICM2017|IEEE Publisher|Nanjing,China|Nov.8-11,2017> Papers of ICICM2017 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus! Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0 <ICICM2016|IEEE Publisher|Chengdu,China|Nov.23-25, 2016 > Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus! Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3 ★Topics: Digital, Analog, Mixed Signal IC and SOC design technology Silicon integrated circuits and manufacturing Low-power, RF devices & circuits IC Computer-Aided –Design technology, DFM Silicon/germanium devices and device physics Interconnect, Low K, High K and other process technologies Unconventional and nano-electronics Organic semiconductor devices and technologies Compound semiconductor devices and circuits Displays, sensors and MEMS Semiconductor materials and material characterization Packaging and testing technology Solar cell & other devices for new energy sources Modeling and simulation Equipment technology Reliability Displays, sensors and MEMS Advance memories technology (Flash, FeRAM, PCM，ReRAM, MRAM etc.) ★Support: 1, Technical Support from IEEE 2, Sponsored by University of Electronic Science and Technology of China and Southeast University, China ★Conference Contact: Ms Daisy Tseng Email: icicm@young.ac.cn Tel: +86-28-87777577