2022 2nd International Conference on Electron Devices and Applications (ICEDA 2022)--SCOPUS, Ei Compendex Website: www.iceda.org Conference Date: May 13-15, 2022. Conference Venue: Singapore Conference Proceedings: Accepted and registered papers will be included in Conference Proceedings, which will be indexed by SCOPUS, Ei Compendex. Publication History: ICEDA 2021 papers have been published in Journal of Physics: Conference Series (Volume 2065) Indexed by Ei Compendex and Scopus! Keynote Speakers in 2022: ~Prof. Franco Maloberti, Univeristy of Pavia, Italy Past President of IEEE Circuits and Systems Society, Life Fellow of IEEE ~Prof. Xianbin Wang, Western University, Canada Fellow of Canadian Academy of Engineering, Fellow of Engineering Institute of Canada, Fellow of IEEE ~Prof. Massimo Alioto, National University of Singapore, Singapore Editor in Chief of the IEEE Transactions on VLSI Systems, Fellow of IEEE ~Prof. Qiang Li, University of Electronic Science and Technology of China, China Distinguished Lecturer of the IEEE Solid-State Circuits Society Founding Chair of IEEE Chengdu SSCS/CASS Joint Chapter Invited Speakers Information, please check: http://www.iceda.org/invited.html Speakers in 2021: Prof. Juin J. Liou (FIEEE), Shenzhen University, China; Prof. Xiaoqing Wen (FIEEE), Kyushu Institute of Technology, Japan; Prof. Daohua Zhang (FInstP, FIET), Nanyang Technological University, Singapore; Assoc. Prof. Jun Wu, Southeast University, China; Prof. Byung Seong Bae, Hoseo University, Korea; Prof. Razika ZAIR TALA-IGHIL, University M’hamed Bougara of Boumerdes, Algeria. More information about speakers, please visit: http://www.iceda.org/keynote.html Submission: You can submit your paper:https://easychair.org/conferences/?conf=iceda2022 For more details, you can learn through: http://www.iceda.org/sub.html Conference Venue: Furama City Centre Add: 60 Eu Tong Sen Street, Pearl's Hill, 059804 Singapore, Singapore Website: https://www.furama.com/citycentre more information, please visit : http://www.iceda.org/venue.html Call for Paper: CMOS platform technologies Logic device performance and circuit design challenges Advanced process integration schemes and scaling approaches Process module and process control advancements Device technology co-optimization solutions SiGe/Ge channel, GAA nanowire and stacked nanosheet Stacked and monolithic 3D integration BEOL compatible transistors --Please check the following link which you can find more topics : http://www.iceda.org/cfp.html Contact: Conference Secretary:Ms. Violet Xie Email: icedaconf@vip.163.com Tel: +86-13103333332 (English&Chinese) Working Time: Monday - Friday 9:30-18:00 (UTC/GMT+08:00)