Full Name: 2027 10th International Conference on Smart Materials Applications (ICSMA 2027) Abbreviation: ICSMA 2027 Sapporo, Japan | January 8-10, 2027 www.icsma.org Smart Materials in Winter Wonderland. The 10th International Conference on Smart Materials Applications (ICSMA 2027) will be held during January 8-10, 2027 in Sapporo, the capital of Hokkaido, known as Japan's "Snow Country". Here, you can enjoy a unique winter experience of snowscapes, hot springs, canals, and gourmet food. ICSMA 2027 is co-organized by the South Asia Institute of Science and Engineering (SAISE), Tokyo University of Science (Japan), Yonsei University (South Korea), and Sichuan University (China), focusing on new advances and applications in the field of smart materials and providing a broad platform for experts and scholars in related fields to exchange the latest research results and discuss academic development directions. **Committees Conference Committee Chairs Prof. Kazuo Umemura, Tokyo University of Science, Japan Prof. Jong Hak Kim, Yonsei University, South Korea Prof. Xiaohong Zhu, Sichuan University, China Program Committee Chairs Assoc. Prof. Jung Tae Park, Yonsei University, South Korea Assoc. Prof. Teik-Cheng Lim, Singapore University of Social Sciences, Singapore Dr. Seok-Keun Koh, C&G Hitech Co., Ltd, Korea **Conference Proceedings All submissions will be peer reviewed, the registered and presented papers will be published in the journals of Scientific.Net(https://www.scientific.net/) collection. Indexed by Elsevier: SCOPUS. **History of ICSMA ICSMA 2026 | JANUARY 28-30, 2026 | TOKYO UNIVERSITY OF SCIENCE, JAPAN. ICSMA 2025 | JANUARY 8-10, 2025 | YONSEI UNIVERSITY, SOUTH KOREA ICSMA 2024 | JANUARY 14-16, 2024 | SINGAPORE ICSMA 2023 | JANUARY 06-08, 2023 | TOKYO, JAPAN ICSMA 2022 | JANUARY 21-24, 2022 | VIRTUAL CONFERENCE ICSMA 2021 | JANUARY 21-24, 2021 | VIRTUAL CONFERENCE ICSMA 2020 | JANUARY 13-16, 2020 | YONSEI UNIVERSITY, SOUTH KOREA ICSMA 2019 | JANUARY 19-22, 2019 | TOKYO, JAPAN ICSMA 2018 | JANUARY 26-28, 2018 | SINGAPORE **Call for Papers (01) Smart & Functional Materials (02) Material Properties & Characterization (03) Manufacturing & Processing (04) Computational & AI-Driven Approaches (05) Applications & Sustainability For more topics, please visit: https://www.icsma.org/cfp.html **Submission Please upload your abstract/full paper to iconf. Submission System (http://confsys.iconf.org/submission/icsma2027). Any questions, please feel free to contact via icsma@saise.org. 1. Full Paper (Presentation and Publication) Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceeding. 2. Abstract (Presentation only) Accepted abstract will be invited to give the presentation at the conference, the presentation will not be published. ★ For more details, please visit: https://www.icsma.org/submission.html **Conference Schedule 2027.01.08: Sign-in & Conference Kit Collection 2027.01.09: Opening Ceremony, Keynote Speeches, Parallel Sessions, Dinner Banquet 2027.01.10: Parallel Sessions, Tour/Visit (Optional) **Contact Us Ms. Sia Fan Email: icsma@saise.org