CONFERENCES

ICMDA 2026
Scopus
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2026 9th International Conference on Materials Design and Applications

posted by organizer: ||41 views||Release time:Jun 18, 2025

Conference DateApr 17-Apr 20, 2026PlaceSendai, Japan
Submission DeadlineNov 25, 2025E-mailicmda@cbees.net
Websitehttps://www.icmda.org/Telephone
DESCRIPTION
* Full Name: 2026 9th International Conference on Materials Design and Applications (ICMDA 2026) * Abbreviation: ICMDA 2026 * Conference Venue: Tohoku University, Sendai, Japan * Conference Date: April 17-20, 2026 * Conference Website: www.icmda.org * ICMDA focus on fundamental research and application areas in the field of the design and application of engineering materials, predominantly within the context of mechanical engineering applications. * Publication: Accepted and registered papers with presentation will be published in below listed journals of Scientific.Net collection. Defect and Diffusion Forum (DDF) (ISSN print 1012-0386 / ISSN web 1662-9507) Solid State Phenomena (SSP) (ISSN print 1012-0394 / ISSN web 1662-9779) Materials Science Forum (MSF) (ISSN print 0255-5476 / ISSN web 1662-9752) Key Engineering Materials (KEM) (ISSN print 1013-9826 / ISSN web 1662-9795) Papers will be sent for indexing by Scopus, Inspec, Chemical Abstracts Service, Google Scholar etc. * History: ICMDA 2024: Vol. 1128. Materials Science Forum-ISBN: 978-3-0364-0681-7-Online Linkage | Indexed by Scopus ICMDA 2023: Vol. 1099. Materials Science Forum-ISBN: 978-3-0364-0438-7-Online Linkage | Indexed by Scopus ICMDA 2022: Vol. 931. Key Engineering Materials-ISBN: 978-3-0357-2847-7-Online Linkage | Indexed by Scopus ICMDA 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1-Online Linkage | Indexed by Ei Compendex & Scopus ICMDA 2020: Vol. 1009, Materials Science Forum-ISBN: 978-3-0357-1688-7-Online Linkage | Indexed by Ei Compendex & Scopus ICMDA 2019: Vol. 972, Materials Science Forum-ISBN: 978-3-0357-1530-9-Online Linkage | Indexed by Ei Compendex & Scopus ICMDA 2018: Vol. 937, Materials Science Forum-ISBN: 978-3-0357-1377-0-Online Linkage | Indexed by Ei Compendex & Scopus * Conference Committee Conference Chairs: Osamu Tabata, Kyoto University of Advanced Science, Japan Takashige Omatsu, Chiba University, Japan Program Chairs: Masahiro Nomura, The University of Tokyo, Japan Kwang Leong Choy, Duke Kunshan University, China Program Co-Chairs: Yoshio Kobayashi, Ibaraki University, Japan Anatoly Zinchenko, Nagoya University, Japan ...... More info about conference Committees: https://icmda.org/com.html * Submission Method: System Submission: https://confsys.iconf.org/submission/icmda2026 Email Submission: icmda@cbees.net For more details, you can learn through: https://icmda.org/sub.html * Call for Paper: -Materials Properties, Measuring Methods and Applications Creep-resistance Fracture Mechanics Mechanical Propertie -Materials Analyses and Modeling Electron Microscopy Artificial Intelligence Methods Computational Material Science -Materials Science and Materials Processing Technology Optical / Electrical / Magnetic Materials Environmental-Friendly Materials Surface Engineering / Coatings Technology For more topics, please visit: http://www.icmda.org/cfp.html * Contact Us: Conference Secretary: Ms. Lynn Email: icmda@cbees.net

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