★Full name: IEEE--2026 The 11th International Conference on Integrated Circuits and Microsystems (ICICM 2026) ★Abbreviation: ICICM 2026 **Place: Xi'an, China **Time: October 23-25, 2026 **Website: http://icicm.net/ ★Co-Sponsored by: ==Xi'an Jiaotong University ==Southeast University ==University of Electronic Science and Technology of China ★Hosted by: ==Xi'an Jiaotong University ==Submission== 1. Full Paper with at least 4 full pages (Presentation and Publication) Template Download in Word: https://www.icicm.net/files/Template.doc Template Download in Latex: https://www.icicm.net/files/IEEE-conference-proceeding-Latex.rar 2. Abstract within 300-500 words (Presentation only) *All manuscripts must be written in English. ★ Electronic submission system: https://easychair.org/conferences/?conf=icicm2026 ★ Email submission: icicm_conf@vip.163.com More detail about submission, please visit at http://icicm.net/submission.html =Publication= Submitted papers will be Peer-Reviewed (Double Blind) and the accepted ones will be collected in the IEEE conference proceedings, included in IEEE Xplore and indexed by EI Compendex and Scopus. ***ICICM2016-2024 (previous 9 years) have been successfully indexed by EI Compendex and Scopus already! =Topics (include but not limit)= Track 1: Electronic Design Automation (EDA) • Progress of EDA algorithms • EDA for emerging technologies • Hardware-software co-design with EDA • EDA in High Performance Computing (HPC) • EDA in analog and mixed-signal design Track 2: Integrated Circuit and System Design • Digital, analog, mixed-signal IC and SOC design technology • IC computer-aided design technology, DFM • Modeling and simulation Track 3: Semiconductor Devices and Circuits • Components and circuits for wireless systems • Low power, RF devices and circuits • Silicon/Germanium Devices and Device Physics • Compound semiconductor devices and circuits Track 4: Process Technology and Manufacturing • Silicon integrated circuits and manufacturing • Interconnect, low-K, high-K and other process technologies • Packaging and testing technology, equipment technology For more topics, please visit at: http://icicm.net/call-for-papers.html ==Organizing Committee== Conference Chairs Zhigong Wang, Southeast University, China Xiulong Wu, Anhui University, China Kaixue Ma, Tianjin University, China Conference Co-Chairs Ning Xu, Wuhan University of Technology, China Xiaoqing Wen, Kyushu Institute of Technology, Japan Qiang Li, University of Electronic Science and Technology of China, China Program Chairs Abdel-Hamid Ali Soliman, Staffordshire University, UK Jun Han, Fudan University, China Xiaopeng Yu, Zhejiang University, China Meng Zhang, Southeast University, China Sheng Chang, Wuhan University, China Yingmei Chen, Southeast University, China Zhikuang Cai, Nanjing University of Posts and Telecommunications, China Zhuo Zou, Fudan University, China (IEEE Senior Member) Jianguo Hu, Sun Yat-sen University , China Bei Yu, The Chinese University of Hong Kong , China Program Co-Chairs Junyong Deng, Xi'an University of Posts & Telecommunications, China Jun Xu, Nanjing University, China Zhixiong Di, Southwest Jiaotong University, China Guojie Luo, Peking University, China Xiaojun Zhai, University of Essex, UK Wei Xing, The University of Sheffield, UK Program Committee Bo Liu, Southeast University, China Shi Pu, Wuhan University of Technology , China Haizhi Song, University Of Electronic Science And Technology Of China, China Lu Zhu, Sun Yat-sen University, China Youming Zhang, Southeast University, China Jianshi Tang, Tsinghua University, China Weiguang Sheng, Shanghai Jiao Tong University, China Hao Gao, Austria & Eindhoven University of Technology, The Netherland Yun Fang, Silicon Austria Labs, Austria Jeff Kilby, Auckland University of Technology, New Zealand Zhijun Zhou, Southeast University, China Xingyuan Tong, Xi`an University Of Posts & Telecommunications, China Wei Hu, Northwestern Polytechnical University, China Zhaori Bi, Fudan University, China Zhengfeng Huang, Hefei University of Technology, China Local Chair Lin Cheng, University of Science and Technology of China Student Program Chairs Hongbin Sun, Xi'an Jiaotong University, China Keping Wang, Tianjin University, China Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, China Fanyi Meng, Tianjin University, China Student Program Committee Li Du, Nanjing University, China Lei Wang, Nanjing University Of Posts And Telecommunications, China Xianbo Li, Sun Yat-sen University, China Tiehu Li, Chongqing University of Technology, China Moufu Kong, University of Electronic Science and Technology of China, China Jiaxin Liu, University of Electronic Science and Technology of China, China Maliang Liu, Xidian University, China Xu Meng, Hefei University of Technology, China Tianming Ni, Anhui University of Engineering, China Qiang Zhao, Anhui University, China More Organizing Committee list, please visit: https://icicm.net/committee.html ==History== ICICM2016 | Chengdu on November 23-25, 2016 ICICM2017 | Nanjing on November 8-11, 2017 ICICM2018 | Shanghai on November 24-26, 2018 ICICM2019 | Beijing on October 25-27,2019 ICICM2020 | Nanjing on October 23-25, 2020 ICICM2021 | Nanjing on October 22-24, 2021 ICICM2022 | Xi'an on October 28-31, 2022 ICICM2023 | Nanjing on October 20-23, 2023 ICICM2024 | Wuhan on October 25-27, 2024 ICICM2025 | Hefei on October 17-19, 2025 =Contact us= Ms. Carrie Lim Email: icicm_conf@vip.163.com Web: http://icicm.net/