Full Name: 2026 the 15th International Conference on Engineering and Innovative Materials (ICEIM 2026) Abbreviation: ICEIM 2026 Place: Kyoto, Japan Date: August 5-7, 2026 Website: http://www.iceim.org/index.html Co-sponsored by: Tokyo Denki University and Kyoto University of Advanced Science Hosted by: Kyoto University of Advanced Science Technically Co-sponsored by: Osaka Institute of Technology 2026 the 15th International Conference on Engineering and Innovative Materials (ICEIM 2026) will be held in Kyoto, Japan during August 5-7, 2026. ICEIM 2026 will feature prestigious keynote speakers in the related areas, parallel sessions, and other technical programs, and aims to create an excellent forum to foster innovation, network with the brightest minds in academia and industry that are working in this field. As an international academic forum where practitioners, researchers, and developers meet to learn and to exchange practical ideas and experiences, ICEIM 2026 sincerely invites you to submit your work in abstracts or full papers to the conference. CALL FOR PAPERS Ⅰ.Materials Science and Engineering Metallic alloys Ceramics and glasses Nanomaterials and technology Composites Polymers Biomaterials Functional materials Metamaterials Optical/Electronic/Magnetic materials Smart/Intelligent materials & intelligent systems Superconducting materials Semiconductor materials Microelectronic materials Sensors and actuators Coating and film Micro-nano fluids Materials for energy storage Material chemistry Advanced engineering materials Material Physics Condensed Matter Physics Phase Transformations and Thermodynamics Ⅱ.Materials Processing and Manufacturing Casting Welding, Sintering, Heat Treatment Surface engineering/Coating Material forming Powder metallurgy Surface treatment Machining Flexible manufacturing technology & system Micro and nano-fabrication Rapid prototyping Additive manufacturing Laser processing technology Ⅲ.Material Simulation, Preparation and Characterization Materials design Advanced processing technology of materials Analysis and characterization of materials interface & surface New technologies and theories of materials characterization X-ray phase analysis Materials genome engineering Materials simulation, computation, and design Computational material science Artificial intelligence technology in materials science and engineering Metallography Residual life analysis Materials science and engineering databases Ⅳ.Materials Properties, Measuring Methods and Applications Ductility Creep resistance Electrical properties Deformation and fracture mechanics Stress-strain behaviour Fatigue Corrosion Crack resistance Magnetic properties Wear resistance Friction and wear Non-destructive testing Working properties of materials and structures For details about topics, please visit http://www.iceim.org/call-for-papers.html PUBLICATION ✿ Conference Proceedings 1. Key Engineering Materials (ISSN print 1013-9826; ISSN cd 1662-9809; ISSN web 1662-9795） Index：SCOPUS, REAXYS, Inspec, CAS, ProQuest, Google Scholar, etc. 2. Applied Mechanics and Materials (ISSN print 1660-9336, ISSN cd 2297-8941, ISSN web 1662-7482） Index：Inspec, CAS, ProQuest, Google Scholar, etc. SUBMISSION 1. Full Paper (Publication and Presentation) 2. Abstract (Presentation Only) 3. Special Session Please upload your full paper/abstract to https://www.zmeeting.org/submission/iceim2026 Please submit proposal for special session to iceim_conf@vip.163.com . For more information, please visit http://www.iceim.org/call-for-sessions.html . CONFERENCE SCHEDULE August 5, 2026---Conference Registration and Materials Collection, Academic Visit August 6, 2026---Keynotes & Breakout Sessions August 7, 2026----Breakout Sessions CONTACT Ms. Joy Wei (Conference Secretary) E-mail: iceim_conf@vip.163.com