Full Name: 2026 6th International Conference on Circuits, Systems and Devices (ICCSD 2026) Abbreviation: ICCSD 2026 Website: https://iccsd.net/ Venue: Ningbo, China Dates: November 13-15, 2026 2026 6th International Conference on Circuits, Systems and Devices (ICCSD 2026) will take place in Ningbo, China during November 13-15, 2026. Sponsored by Ningbo University, ICCSD 2026 will offer a distinguished interdisciplinary platform for researchers, practitioners, and educators to showcase and deliberate on the latest innovations, trends, and concerns, as well as the practical challenges faced and solutions adopted in the realms of Circuits, Devices, and Systems. [ Conference Awards ] Young Scientist Award Best Student Paper Award Outstanding Organization Award Best Oral Presentation Award Best Poster Presentation Award Outstanding Reviewer Awards [ Proceedings ] All papers submitted to ICCSD that fall within its technical scope will be published in the Conference Proceedings, and at least one author of each accepted paper is expected to present at the conference. ICCSD 2021: Online ISSN: 1742-6596. online, indexed by Ei Compendex & Scopus. ICCSD 2020: Online ISSN: 1742-6596. online, indexed by Ei Compendex & Scopus. ICCSD 2019: ISBN: 978-1-7281-3062-0. IEEE Xplore, indexed by Ei Compendex & Scopus. ICCSD 2018: ISBN: 978-1-5386-8311-8. IEEE Xplore, indexed by Ei Compendex & Scopus. ICCSD 2017: ISBN: 978-1-5386-1870-7. IEEE Xplore, indexed by Ei Compendex & Scopus. [ Call for Papers ] Track 1: Microelectronic Devices Advanced Transistors（GAAFETs/ VSAFETs） Wide Bandgap Semiconductor Devices Quantum Devices Compound Semiconductor Devices Spintronic Devices Track 2: Power Devices and Power Management Insulated-Gate Bipolar Transistor (IGBT) Power MOSFET Silicon Carbide（SiC） Nano Energy Devices Energy Conversion Devices Energy Harvesting Technology DC-DC Converter Power Management & Energy Efficient Technology Track 3: Sensors and Displays Bio/Gas/Thermal/Voltage/Current Sensors Vision Intelligence & Image Sensors Acoustic Sensors Display Technology & Devices Photoelectric Conversion & Optical Fiber Sensing Track 4: Electromagnetics & Microwave Devices Power Amplifiers Mixer & Microwave Sources Terahertz Devices Magnetic Devices Electromagnetic Components Antenna Design Terahertz Sensing and Imaging Computational Electromagnetics Track 5: 3D Integration & Microsystems System in Package（SiP） Through Glass Via & Through Silicon Via 3D Integration Technology High Density Packaging CAD Tools for Packing Microelectromechanical Systems Photoelectric Fusion Module Chiplets Based Microsystems Wafer-Scale Integration & System on Wafer Track 6: Digital Devices & VLSI Physical Design Nonvolatile Memory Computing in Memory Emerging Memory Technologies Clock Generator and Management Physical Modeling for VLSI Design Placement & Routing Algorithm Evaluation Methods for VLSI Reliability Aging Prediction & Mitigation more details: https://iccsd.net/cfp.html [ Call for Special Session ] Special Sessions may address one or more Tracks, but they should be Organized under a unified theme. Special Sessions are intended to allow projects or any other group of authors to present their own work. It is not expected that open calls for papers are launched for Special Sessions, in order to attract authors or presenters. Special Sessions will be evaluated according to the following criteria: – Relevance – Timeliness – Technical content – Novelty – Overall Recommendation more details: https://iccsd.net/ss.html [ Submission ] Make a submission: https://www.zmeeting.org/submission/iccsd2026 more details: https://iccsd.net/submission.html [ Contact us ] Dr. Fidelia Lee E-mail: iccsd@academic.net