CONFERENCES

ECTC 2025
0

2025 IEEE 75th Electronic Components and Technology Conference

posted by organizer: ||168 views||Release time:Nov 07, 2024

Conference DateMay 27-May 30, 2025PlaceDallas, United States
Submission DeadlineFeb 21, 2025E-mail pgromala@ieee.org
Websitehttps://www.ectc.net/Telephone
DESCRIPTION
On behalf of the IEEE Electronic Components and ECTC Program Committee, it is my pleasure to invite you to submit an abstract for the anniversary 75th ECTC, to be held May 27–30, 2025, at the Gaylord Texan Resort and Convention Center in Dallas, Texas. This premier international conference, sponsored by the IEEE Electronics Packaging Society (EPS), covers a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, wafer level packaging, photonics and optoelectronics, IoT, 5G, quantum computing and systems, 2.5D and 3D integration technology, and other emerging technologies in electronics packaging. The ECTC Program Committee consists of over 200 experts from diverse technical fields and is dedicated to creating an engaging technical program. The 74th ECTC was an outstanding success, setting new records with 704 abstract submissions, a record number of exhibitors, and 2,005 registered attendees from 26 countries. It featured 383 technical papers presented in 36 oral sessions and five interactive sessions, including a session dedicated to students. Additionally, nine special sessions covered a variety of advanced packaging topics, such as industry-government coinvestments in North America, Asia, and Europe, advanced metrology, thermal management for AI/ML applications, RF packaging for communication and sensing, the Young Professional Network Panel, challenges of chiplets, workforce diversity, and a brand-new session on Emerging Start-Ups for Advanced Packaging. On Tuesday, the first full-day of the conference we held a Heterogeneous Integration Roadmap (HIR) workshop. Paper Submission Process Use the manuscript submission website, once available, to submit your manuscript for review on or before the deadline (Feb. 21, 2025). The session co-chairs manage the manuscript review process and guide you towards final submission of your manuscript (your paper) if accepted. Final submission and copyright procedures (release form) are arranged through the IEEE Computer Society Conference Publishing Service (CPS). Accepted papers are published in the conference proceedings. Papers that are successfully presented at the conference by the author are published online post-conference by IEEE. Carefully read the acceptance email sent to you regarding the necessary requirements to get your paper published, both in the conference proceedings and online. Your copyright release form is also required. Further queries should be directed to Program Chair Przemyslaw Gromala. ECTC 2025 Host Hotel: Gaylord Texan Resort & Convention Center 1501 GAYLORD TRAIL, GRAPEVINE, TEXAS, USA, 76051

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