DESCRIPTION
The 9th IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS 2027)
Time: September 20-22, 2027
Venue: Hangzhou, China
Official Website: https://2027.ieee-aicas.org/
【About Conference】
The 9th IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS 2027) will be held in Hangzhou, China during September 20-22, 2027.
The next generation of AI will not only answer: it will perceive, plan and act, in robots, vehicles, wearables and autonomous agents. AICAS 2027 invites contributions on the circuits and systems that make this possible, under tight limits of energy, latency, memory and safety.
AICAS 2027 aims to offer an excellent platform allowing world scholars, technology researchers, and industry to exchange experiences, demonstrate their studies, and further advance AI circuits and systems technologies.
➤Sponsored by
IEEE
IEEE CIRCUITS AND SYSTEMS SOCIETY
➤Technically sponsored by
Hangzhou International Innovation Institute of Beihang University
【Co-located with APCCAS】
The co-location gives every participant access to a program larger than either conference alone.
【Conference Committee】
➤ General Chair
Amara Amara, Beihang University, China
➤ General Co-Chair
Weisheng Zhao, Beihang University, China
➤ Technical Program Committee Chair
Yoshifumi Nishio, Tokushima University, Japan
➤ Technical Program Committee Co-Chairs
Xueyan Wang, Beihang University, China
Zhou Jin, Hong Kong University, China
➤ Special Sessions Chair
Hanhoo Lee, Inha University, South Korea
➤ Special Sessions Co-Chairs
Xiaotao Jia, Beihang University, China
Antoine Frappe, Lille University, France
➤ Tutorial Chair
Yen-Kuang Chen, Intel, USA
➤ Tutorial Co-Chairs
Mohamad Sawan, Westlake University, China
Yen-Kuang Chen, University of Tennessee, USA
➤ Publicity Chair
Wei Mao, Southern University of Science and Technology, China
➤ Finance Chair
Ge Tong, NTU, Singapore
➤ Finance Co-Chair
Amara Amara, Beihang University, China
➤ Industry Liaison Chair
Victor Grimblatt, Synopsys, Chile
➤ Industry Liaison Co-Chairs
Preet Yadav, NXP Semiconductors, India
Wenzhuo Zhang, Alibaba Hangzhou, China
Sylvain Eimer, Truth Equipment, Ltd, China
➤ Local Arrangement Chair
Yueting Li, Beihang University, China
➤ Conference Assistant
Zou Xi, Zhejiang International Studies University, China
【Topics】
Topics include, but are not limited to:
• Hardware for embodied AI: perception, sensor fusion, motion control and robotics processors
• Accelerators for agentic AI, large language models and multimodal foundation models
• Computing-in-memory, near-memory and processing-in-sensor architectures
• Emerging devices for AI: spintronic, resistive, ferroelectric, phase-change and photonic
• Neuromorphic and spiking circuits and systems
• Edge and on-device AI: low-power inference, on-chip learning and continual learning
• Hardware–software co-design, compilers and AI for EDA
• Chiplets, 3D integration and memory systems for AI
• Trustworthy, secure and reliable AI hardware
• AI circuits and systems for healthcare, mobility, manufacturing and smart cities
【Paper Submission Link】
Paper submission link: https://easychair.org/conferences/?conf=aicas2027
【Paper Formatting】
1、Full-length papers should have a maximum length of five (5) pages in PDF, with the fifth page reserved for references only.
2、The paper format should follow the IEEE conference templates for Letter page size.
3、Submitted manuscripts must describe original work which has not been submitted, accepted, or published in other conferences or journals.
4、Please use the official IEEE conference templates in Letter page size to prepare your manuscript: https://2027.ieee-aicas.org/submission.html
【Contact】
Email: aicas2027@youngac.cn