The 8th Semiconductor Design, Construction & Engineering Summit brings together semiconductor manufacturers, fab owners, EPC contractors, engineers, technology providers and industry leaders to address the challenges and opportunities shaping the next generation of U.S. chip manufacturing. As domestic manufacturing capacity continues to expand, the industry faces increasing pressure to deliver advanced facilities faster, strengthen supply chains, secure skilled talent, and build the resilient infrastruc- ture required to support increasingly sophisticated production environments. From advanced packaging and High-NA EUV readiness to mega-fab project execution, utility infrastructure and cleanroom engineer- ing, organisations are rethinking how semiconductor facilities are designed, constructed and commis- sioned. Taking place in Phoenix, Arizona—one of the world's most dynamic semiconductor hubs—the summit provides a platform for sharing practical insights, lessons learned and proven strategies for achieving engineering excellence and successful project delivery. Through expert-led discussions and peer-to-peer exchange, attendees will gain valuable perspectives on the priorities defining the future of semiconductor manufacturing.